Date

August 7 - 8, 2019

Location

Hyatt Regency Denver Tech Center: 7800 East Tufts Avenue Denver, Colorado, 80237

Speakers

2 days networking

Advancements in Thermal Management Conference Overview

The Advancements In Thermal Management conference educates attendees on the latest advancements in thermal management and temperature mitigation, covering topics such as electronics packaging, air and liquid cooling, heat pipes, thermal materials/TIMS, temperature sensing and control, system design and management for optimizing thermal properties.

The conference is organized for design engineers, academia, system engineers, material scientists, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.

Attend if You Work in These Industries – Aerospace, Electronics Packaging, Automotive, Semiconductor/ICs, LED Cooling, Motor Controls, Power Supplies, Discrete Electronic Devices, Telecom, Batteries, and more.

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Who Should Attend

Professionals Working with These Technologies

  • Thermal Management & Electronics Cooling
  • Thermal Materials
  • Thermal Design and Modeling
  • Infrared/Thermography
  • Air and Liquid Cooling
  • Characterization and Measurement for Thermal Materials
  • Thermal Ground Planes
  • IC Level Thermal Management
  • R&D in Thermal Management Related Spaces
  • Thermistors, Thermocouples, Thermoelectrics and Insulation
  • Thermal Sensing and Measurement (Sensors, Instruments, & Test Equipment)
  • Thermal Control

Academia
Researchers, professors and students working towards the goal of advancing thermal management materials and technologies.


Management Executives

– Purchasing
– Design and Products Development
– Sales and Marketing


Industry Consultants and Finance Executives

– Bankers and Private Equity
– Venture Capital Professionals
– Business and Strategy Consultants

Recent News

Henkel Expands Bergquist Gap Pad Portfolio

Henkel Corp. has added two ultra-low modulus Bergquist Gap Pad thermal interface materials (TIMs) to its line of high compliance thermal management products. Bergquist Gap Pad TGP 6000ULM and Bergquist Gap Pad TGP 7000ULM have been formulated with an advanced resin platform

Black Phosphorus Wrinkles Take the Heat

Single atomic sheets of black phosphorus are attracting attention for their potential in future electronics applications. A*STAR researchers have now completed experiments at the nanoscale to unlock the secret of this material’s remarkable directional heat transport properties. Black phosphorus has a layered

Charting a Map for Determining Negative Thermal Expansion

Most materials exhibit some degree of thermal expansion – that is, they expand when heated and shrink when cooled. Concrete structures are designed with joints that allow for this expansion and contraction, to prevent cracking and structural failure. Some materials, however, exhibit

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Early bird pass before June 14th, 2019: $750.    Full Rate Pass After June 14th, 2019: $895.    Onsite Rate Begins August 7th, 2019: $1095

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