Henkel Corp. has added two ultra-low modulus Bergquist Gap Pad thermal interface materials (TIMs) to its line of high compliance thermal management products. Bergquist Gap Pad TGP 6000ULM and Bergquist Gap Pad TGP 7000ULM have been formulated with an advanced resin platform
The Advancements In Thermal Management conference educates attendees on the latest advancements in thermal management and temperature mitigation, covering topics such as electronics packaging, air and liquid cooling, heat pipes, thermal materials/TIMS, temperature sensing and control, system design and management for optimizing thermal properties.
The conference is organized for design engineers, academia, system engineers, material scientists, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.
Attend if You Work in These Industries – Aerospace, Electronics Packaging, Automotive, Semiconductor/ICs, LED Cooling, Motor Controls, Power Supplies, Discrete Electronic Devices, Telecom, Batteries, and more.