New Way to Cool Computer Chips Involves Laser Metal Printing

Researchers from Binghamton University’s Mechanical Engineering Department have developed a manufacturing technique that will keep electronics cooler by 10 degrees Celsius (18 degrees Fahrenheit), allowing for faster, more efficient computation. Assistant Professor Scott Schiffres and graduate students Arad Azizi and Matthias A.

Composite Material can Cool itself Down Under Extreme Temperatures

A cutting-edge material, inspired by nature, that can regulate its own temperature and could equally be used to treat burns and help space capsules withstand atmospheric forces is under development at the University of Nottingham. The research paper, Temperature – dependent polymer

Electronic Component Testing: A Non-Contact Sport

Electronics don’t like it hot. That’s why electronic systems designers are looking for ways to keep their components cool while the sizes of their devices shrink. As chips get smaller and their densities within components grow, heat can become a real problem—not

Fujipoly Provides the Perfect Fit

Fujipoly offers an assortment of standard as well as custom size molded Sarcon Cases. The thermally conductive, box-shaped components are open on one end to facilitate fast and easy installation over transistors and other heat generating components. Once installed, Fujipoly’s unique thermally

AGM Launches Genable Thermal Paste Adhesives Range

Applied Graphene Materials (AGM), the UK based manufacturer of commercial graphene enhanced dispersions, has launched two high performance thermal paste adhesive materials – Genable 4400 and Genable 4300. The new products are supplied to customers as easy to process two part epoxy

Supercomputer Predicts Optical and Thermal Properties of Complex Hybrid Materials

Materials scientists at Duke University computationally predicted the electrical and optical properties of semiconductors made from extended organic molecules sandwiched by inorganic structures. These types of so-called layered “hybrid organic-inorganic perovskites”—or HOIPs—are popular targets for light-based devices such as solar cells and