Heat Transfer Surprise Could Lead to Thermal Transistors

As much as 100 times more heat than predicted by the standard radiation theory can flow between two nanoscale objects, even at bigger-than-nanoscale distances, researchers at the University of Michigan and the College of William and Mary have reported in the journal Nature.

Improved Thermal-Shock Resistance in Industrial Ceramics

Ceramic materials are used in nuclear, chemical and electrical power generation industries because of their ability to withstand extreme environments. However, at high temperatures, ceramics are susceptible to thermal-shock fractures caused by rapid temperature-changing events, such as cold water droplet contact with

Thermal Switch Discovered in Engineered Squid-Based Biomaterials

Tuning materials for optimal optical and electrical properties is becoming commonplace. Now, researchers and manufacturers may be able to tune materials for thermal conductivity by using a squid-inspired protein made of multiple DNA repeats. “Controlling thermal transport in modern technologies — refrigeration,

Semiconductor Research Corp. Releases $26 Million in New Research Funds

Semiconductor Research Corp. (SRC) released $26 million in added research funding for its New Science Team (NST) Joint University Microelectronics Program (JUMP). JUMP will fund 24 additional research projects spanning 14 US universities. The projects will be integrated into JUMP’s six existing research centers. NST

Superflexible Aerogels are Efficient Absorbents and Thermal Insulators

Aerogel has, until now, been limited due to brittleness for the practical application of these delicate solids, which consist almost entirely of air-filled pores. This may now change, as the the journal Angewandte Chemie reports that Japanese researchers have now introduced extremely elastic aerogels

NASA Awards Space Technology Award for new Advanced 3D Thermal Material

Bally Ribbon Mills has received a Space Technology Award from NASA’s Space Technology Mission Directorate (STMD) for weaving the 3D material used within NASA’s Heat Shield for Extreme Entry Environment Technology (HEEET) project. The HEEET project aims to develop a new Thermal Protection System that leverages

Reinforced Thermal Film for Die-Cutting Released

New thermal interface composite film has been released by Fujipoly. The Sarcon 15GTR is a thin TIM made from heat conducting silicon with a 0.05 mm fiberglass reinforcement layer. The 0.15 mm think film is suited for applications with complex die-cut shapes,