Unitika Unveils High-Heat Aromatic Polyamide

Unitika has developed a series of polyamide (PA) resins that can be applied in demanding thermal-management applications. The company has tailored specific grades for applications such as LED components and electric motor parts that are utilized in the auto and electrical/electronic sectors

Nano One Signs a Joint Development Agreement with Saint-Gobain

Nano One CEO, Mr. Dan Blondal has announced that the company has entered into a Joint Development Agreement with Saint-Gobain. The goal of the collaboration is to enhance high temperature processing of Nano One’s lithium ion battery materials. Saint-Gobain is a multi-billion

DARPA to Host Hypersonic Thermal Management Material Design Program

The Defense Advanced Research Projects Agency will conduct a Proposers Day on Jan. 22 in Arlington, Va., to discuss a new program that aims to build and demonstrate structures designed to address the thermal challenge associated with hypersonic vehicles’ leading edges. “For decades people

New Materials Could Turn Heat into Electricity

Scientists are getting closer to designing thermoelectric materials that could efficiently harvest heat from the surrounding environment and convert it into electricity to power devices and appliances, according to a review of the latest research in the journal Science and Technology of

FLIR InSite Mobile Application Simplifies Inspection Management

FLIR Systems, Inc. has launched FLIR InSite, a new mobile application and web portal for organizing client information and thermal inspection data in one location that is easy to access, manage, and share. Ideal for electricians, electrical contractors, and thermography service professionals,

Future Facilities wins Design Tools and Development Software Award

6SigmaET, a thermal simulation CFD tool designed by Future Facilities, was announced as the winner of the Design Tools and Development Software Award at the Elektra Awards 2018.  For more than 10 years, the Elektra Awards have celebrated excellence in technological innovation, recognising the very best

New Way to Cool Computer Chips Involves Laser Metal Printing

Researchers from Binghamton University’s Mechanical Engineering Department have developed a manufacturing technique that will keep electronics cooler by 10 degrees Celsius (18 degrees Fahrenheit), allowing for faster, more efficient computation. Assistant Professor Scott Schiffres and graduate students Arad Azizi and Matthias A.