Future Facilities has released the thirteenth iteration of its leading 6SigmaET thermal simulation software. The latest version brings a series of new features that boost performance, increase simulation speed and ensure greater compatability with the most popular electronics and product design tools.
6SigmaET, a thermal simulation CFD tool designed by Future Facilities, was announced as the winner of the Design Tools and Development Software Award at the Elektra Awards 2018. For more than 10 years, the Elektra Awards have celebrated excellence in technological innovation, recognising the very best
Researchers from Binghamton University’s Mechanical Engineering Department have developed a manufacturing technique that will keep electronics cooler by 10 degrees Celsius (18 degrees Fahrenheit), allowing for faster, more efficient computation. Assistant Professor Scott Schiffres and graduate students Arad Azizi and Matthias A.
KULR Technology Group, Inc. will provide specific-use thermal management material to Leidos for ongoing testing, research and development on defense-related projects. Details of the agreement, the specific materials, and proposed projects are under security restrictions and will not be released but company leaders highlighted
A cutting-edge material, inspired by nature, that can regulate its own temperature and could equally be used to treat burns and help space capsules withstand atmospheric forces is under development at the University of Nottingham. The research paper, Temperature – dependent polymer
Electronics don’t like it hot. That’s why electronic systems designers are looking for ways to keep their components cool while the sizes of their devices shrink. As chips get smaller and their densities within components grow, heat can become a real problem—not
Lattice thermal conductivity strongly affects the applications of materials related to thermal functionality, such as thermal management, thermal barrier coatings and thermoelectrics. In order to understand the lattice thermal conductivity more quantitatively and in a time- and cost-effective way, many researchers devoted
Fujipoly offers an assortment of standard as well as custom size molded Sarcon Cases. The thermally conductive, box-shaped components are open on one end to facilitate fast and easy installation over transistors and other heat generating components. Once installed, Fujipoly’s unique thermally
Applied Graphene Materials (AGM), the UK based manufacturer of commercial graphene enhanced dispersions, has launched two high performance thermal paste adhesive materials – Genable 4400 and Genable 4300. The new products are supplied to customers as easy to process two part epoxy
The U.S. Army is on the hunt for new materials science breakthroughs by working together with a researcher from Brazil. The U.S. Army Research Laboratory has a cooperative research and development agreement with the Pontifícia Universidade Católica do Rio de Janeiro, known