Thick Print Copper Technology Increases Thermal Reliability

Ryan Persons, Technical Services Engineer, Heraeus Electronics Dr. Paul Gundel, Product Manager, Heraeus Electronics To meet the increasing demands of the power electronics market for high reliability under harsh environmental conditions, designers are striving to maximize the thermal performance of high-power applications. Currently,

Solving the Solver: The New Generation of Thermal Simulation

Tom Gregory, 6SigmaET Product Specialist As consumers demand every smaller yet more powerful devices, engineers are faced with an increasingly difficult balancing act between device size, power, battery life and even environmental sustainability. For those of us working in the field of thermal

Taking the Heat Out of Measuring Thermal Conductivity

Dr. Giles Humpston, Cambridge Nanotherm The critical importance of quickly removing heat from electronic components is well documented. In the case of LEDs allowing a design to ‘run hot’ drastically reduces component lifespan and significantly increases the risk of catastrophic component failure.