Observation of Anisotropic Magneto-Peltier Effect

For the first time in the world, NIMS and Tohoku University jointly observed an anisotropic magneto-Peltier effect–a thermoelectric conversion phenomenon in which simple redirection of a charge current in a magnetic material induces heating and cooling. Thermoelectric heating and cooling are conventionally

3D Printed Impingement Chip Cooler Cools ICs like a Showerhead

High performance electronic systems are coping with increasing cooling demands. Conventional solutions realize cooling through combining heat exchangers that are bonded to heat spreaders that are then attached to the chip backside. These are all interconnected with thermal interface materials (TIM) that

Researcher Develops a New Generation of Graphene

Graphene has many incredible properties, but to date it has been difficult to use on a large scale in industry due to the fact it loses its properties and goes back to its origin graphite when it is used in that scale.

6SigmaET Release Enhances Modelling for Faster Thermal Simulation

Future Facilities has launched Release 12 of its thermal simulation software, 6SigmaET. This release incorporates a number of significant modelling enhancements that deliver another boost to overall simulation speed – extending 6SigmaET’s performance advantage compared to alternative tools. Release 12 also includes

Taking Temperature in 2D

To build robust electronic devices, it is crucial to know how the components change size in response to heat generated by electric currents. A new experiment demonstrates electron microscopy as a tool for creating a map—with nanometer resolution—of thermal expansion in 2D