George Meyer, CEO Celsia, Inc. I’m often asked which two-phase cooling technology, heat pipes or vapor chambers, is best suited for a particular electronics application. While there are some good rules of thumb the answer isn’t always simple. Nonetheless, this article aims
George Meyer, CEO Celsia, Inc At some point in a thermal system design project it may become apparent that the tried and true methods of increasing thermal efficiency – solid base, fin & fan – just aren’t sufficient. Keep out zones prohibit
Justin Moll, Vice President, US Market Development Pixus Technologies Electronics enclosures are used in countless test/analytics/measurement devices for multiple end markets. This includes various instrument systems in Oil & Gas, Industrial & Power Control, Medical, Lab/Test, and Military designs. The end applications are
Benjamin Cook, Cradle North America Inc. Electronic devices are getting smaller, yet they are more powerful. More and more electronic components are being packed onto PCBs, which generate more heat and makes heat management critical. Overheating will not only affect the chips
Ryan Persons, Technical Services Engineer, Heraeus Electronics Dr. Paul Gundel, Product Manager, Heraeus Electronics To meet the increasing demands of the power electronics market for high reliability under harsh environmental conditions, designers are striving to maximize the thermal performance of high-power applications. Currently,
Tom Gregory, 6SigmaET Product Specialist As consumers demand every smaller yet more powerful devices, engineers are faced with an increasingly difficult balancing act between device size, power, battery life and even environmental sustainability. For those of us working in the field of thermal
Dr. Giles Humpston, Cambridge Nanotherm The critical importance of quickly removing heat from electronic components is well documented. In the case of LEDs allowing a design to ‘run hot’ drastically reduces component lifespan and significantly increases the risk of catastrophic component failure.