Acoustic Micro Imaging (AMI) is a nondestructive inspection technique that utilizes high frequency ultrasound to detect a wide variety of defects and failures within materials. One unique aspect of ultrasound is its ability to detect “air-gap” type flaws such as cracks, voids, dis-bonds and/or delaminations. In applications when heat transfer and/or structural integrity is critical, the ability to detect these “air-gap” type flaws can be crucial. An air gap often means less bond and/or surface area for heat dissipation and thus further cause for potential failure. This is especially true for micro integrated circuits (IC’s) that often require heat dissipation from the internal components.
There are many devices, components and related materials that include multi-laminates for both structural integrity as well as heat transfer. AMI is a proven technology that can inspect and measure an internal surface and/or interface to detect these air-gap type flaws. The inspected area can then be correlated from a % bond vs dis-bond to obtain a certain pass/fail criteria setup for that specific product and/or device. The technology can be applied to a variety of materials including, polymers, ceramics, metals and composites as well as paste, solders and epoxies. This presentation will review the basic theory and principles behind the technology and show examples where it can be applied within the microelectronic, electronic and industrial market sectors.