The growth of automotive electronics as a result of increased volume and new function is forcing change in PCB design and reliability requirements in the automotive market. With advances in safety systems, growth in infotainment and additional requirements for connectivity, there is a universal increase in complexity to the PCB design and the density of these circuit boards. There is also an environmental push for more electric car offerings. All of these mentioned advances in the automotive space have resulted in applications that include high voltage, high power and/or high density for the printed circuit board designs.
This presentation will investigate technology changes in the market segment and how that effects electronic function and heat management. It will then discuss how these effect board materials and components which are causing concerns for design and fabrication. The paper will investigate these changes from both perspectives of circuit board application and location within the car.
Subsequently, we will propose a unique electroplating method to create copper filled through or buried vias as a design technique to increase the PCBs ability to manage heat. The presentation will discuss and illustrate how this design change can increase the product life and contrast it to current techniques.