Researchers from Binghamton University’s Mechanical Engineering Department have developed a manufacturing technique that will keep electronics cooler by 10 degrees Celsius (18 degrees Fahrenheit), allowing for faster, more efficient computation. Assistant Professor Scott Schiffres and graduate students Arad Azizi and Matthias A.
High performance electronic systems are coping with increasing cooling demands. Conventional solutions realize cooling through combining heat exchangers that are bonded to heat spreaders that are then attached to the chip backside. These are all interconnected with thermal interface materials (TIM) that