Researchers from Binghamton University’s Mechanical Engineering Department have developed a manufacturing technique that will keep electronics cooler by 10 degrees Celsius (18 degrees Fahrenheit), allowing for faster, more efficient computation. Assistant Professor Scott Schiffres and graduate students Arad Azizi and Matthias A.
KULR Technology Group, Inc. will provide specific-use thermal management material to Leidos for ongoing testing, research and development on defense-related projects. Details of the agreement, the specific materials, and proposed projects are under security restrictions and will not be released but company leaders highlighted
Applied Graphene Materials (AGM), the UK based manufacturer of commercial graphene enhanced dispersions, has launched two high performance thermal paste adhesive materials – Genable 4400 and Genable 4300. The new products are supplied to customers as easy to process two part epoxy
ECE Assistant Professor Lucy Shi and her team of researchers in the Advanced Semiconductor Materials and Devices Laboratory at UIC are focusing on using a novel method for cooling hotspots in electronics and capturing the wasted heat to use to power the devices. The
Aerogel has, until now, been limited due to brittleness for the practical application of these delicate solids, which consist almost entirely of air-filled pores. This may now change, as the the journal Angewandte Chemie reports that Japanese researchers have now introduced extremely elastic aerogels
Professor Yongjie Hu and his group at UCLA MAE, for the first time, experimentally realized a new compound single crystal, boron arsenide (BAs) free of defects and observed the highest isotropic thermal conductivity beyond all metals and semiconductors. This study established a
The inner workings of high-power electronic devices must remain cool to operate reliably. High internal temperatures can make programs run slower, freeze or shut down. Researchers at the University of Illinois at Urbana-Champaign and The University of Texas, Dallas have collaborated to
The search for materials with extreme thermal properties continues because of their importance for thermal management applications. Materials with low κ are used in data storage devices, thermal barrier coatings, and thermoelectrics, whereas high-κ materials are useful for thermal energy transmission and
Researchers at Chalmers University of Technology have developed a graphene assembled film that has more than 60 percent higher thermal conductivity than graphite film – despite the fact that graphite simply consists of many layers of graphene. The graphene film shows potential
Graphene has many incredible properties, but to date it has been difficult to use on a large scale in industry due to the fact it loses its properties and goes back to its origin graphite when it is used in that scale.