Unitika Unveils High-Heat Aromatic Polyamide

Unitika has developed a series of polyamide (PA) resins that can be applied in demanding thermal-management applications. The company has tailored specific grades for applications such as LED components and electric motor parts that are utilized in the auto and electrical/electronic sectors

DARPA to Host Hypersonic Thermal Management Material Design Program

The Defense Advanced Research Projects Agency will conduct a Proposers Day on Jan. 22 in Arlington, Va., to discuss a new program that aims to build and demonstrate structures designed to address the thermal challenge associated with hypersonic vehicles’ leading edges. “For decades people

New Way to Cool Computer Chips Involves Laser Metal Printing

Researchers from Binghamton University’s Mechanical Engineering Department have developed a manufacturing technique that will keep electronics cooler by 10 degrees Celsius (18 degrees Fahrenheit), allowing for faster, more efficient computation. Assistant Professor Scott Schiffres and graduate students Arad Azizi and Matthias A.

AGM Launches Genable Thermal Paste Adhesives Range

Applied Graphene Materials (AGM), the UK based manufacturer of commercial graphene enhanced dispersions, has launched two high performance thermal paste adhesive materials – Genable 4400 and Genable 4300. The new products are supplied to customers as easy to process two part epoxy

Superflexible Aerogels are Efficient Absorbents and Thermal Insulators

Aerogel has, until now, been limited due to brittleness for the practical application of these delicate solids, which consist almost entirely of air-filled pores. This may now change, as the the journal Angewandte Chemie reports that Japanese researchers have now introduced extremely elastic aerogels