Date

August 7 - 8, 2019

Location

Hyatt Regency Denver Tech Center: 7800 East Tufts Avenue Denver, Colorado, 80237

Speakers

2 days networking

Advancements in Thermal Management Conference Overview

The Advancements In Thermal Management conference educates attendees on the latest advancements in thermal management and temperature mitigation, covering topics such as electronics packaging, air and liquid cooling, heat pipes, thermal materials/TIMS, temperature sensing and control, system design and management for optimizing thermal properties.

The conference is organized for design engineers, academia, system engineers, material scientists, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.

Attend if You Work in These Industries – Aerospace, Electronics Packaging, Automotive, Semiconductor/ICs, LED Cooling, Motor Controls, Power Supplies, Discrete Electronic Devices, Telecom, Batteries, and more.

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Who Should Attend

Professionals Working with These Technologies

  • Thermal Management & Electronics Cooling
  • Thermal Materials
  • Thermal Design and Modeling
  • Infrared/Thermography
  • Air and Liquid Cooling
  • Characterization and Measurement for Thermal Materials
  • Thermal Ground Planes
  • IC Level Thermal Management
  • R&D in Thermal Management Related Spaces
  • Thermistors, Thermocouples, Thermoelectrics and Insulation
  • Thermal Sensing and Measurement (Sensors, Instruments, & Test Equipment)
  • Thermal Control

Academia
Researchers, professors and students working towards the goal of advancing thermal management materials and technologies.


Management Executives

– Purchasing
– Design and Products Development
– Sales and Marketing


Industry Consultants and Finance Executives

– Bankers and Private Equity
– Venture Capital Professionals
– Business and Strategy Consultants

Recent News

Rice University Unveils New Way to Beat the Heat in Electronics

A nanocomposite invented at Rice University’s Brown School of Engineering promises to be a superior high-temperature dielectric material for flexible electronics, energy storage and electric devices. The nanocomposite combines one-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets. The nanofibers reinforce the self-assembling material while the “white graphene” nanosheets

Ultra-Compressible Thermal Putty

Sarcon PG80A is an extremely compressible, high-performance thermal interface material. This advanced putty-like, gap filler pad exhibits a thermal resistance as low as 0.08°C•in2/W at 14.5 PSI with a thermal conductivity of 13 W/m°K. Sarcon® PG80A requires very low compression force at

Two Types of Cooling Require Different Designs

Thermoelectric devices can be used to remove heat from hot objects, like computer components or batteries. However, these so-called Peltier coolers are typically optimized for keeping a cold object cold, which is a different thermodynamics problem. Researchers have now developed a new

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Early bird pass before June 14th, 2019: $750.    Full Rate Pass After June 14th, 2019: $895.    Onsite Rate Begins August 7th, 2019: $1095

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