Smart Electronic Adhesives for Microelectronics – Enabled by Low Viscosity Nanocomposite Materials

Dr. Andreas Funck, Head of AT Electronics, Evonik Nutrition & Care GmbH Torsten Lubenow, AT Electronics, Evonik Nutrition & Care GmbH Abstract Epoxy resins commonly used for the encapsulation of electronic materials are often filled with various inorganic materials to reduce the

Cool It Your Way: Versatile Cooling for Electronics Enclosures

Justin Moll, Vice President, US Market Development Pixus Technologies Electronics enclosures are used in countless test/analytics/measurement devices for multiple end markets.  This includes various instrument systems in Oil & Gas, Industrial & Power Control, Medical, Lab/Test, and Military designs.   The end applications are