Rice University Unveils New Way to Beat the Heat in Electronics

A nanocomposite invented at Rice University’s Brown School of Engineering promises to be a superior high-temperature dielectric material for flexible electronics, energy storage and electric devices. The nanocomposite combines one-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets. The nanofibers reinforce the self-assembling material while the “white graphene” nanosheets

Ultra-Compressible Thermal Putty

Sarcon PG80A is an extremely compressible, high-performance thermal interface material. This advanced putty-like, gap filler pad exhibits a thermal resistance as low as 0.08°C•in2/W at 14.5 PSI with a thermal conductivity of 13 W/m°K. Sarcon® PG80A requires very low compression force at

Two Types of Cooling Require Different Designs

Thermoelectric devices can be used to remove heat from hot objects, like computer components or batteries. However, these so-called Peltier coolers are typically optimized for keeping a cold object cold, which is a different thermodynamics problem. Researchers have now developed a new

Modulating the Thermal Conductivity in Hexagonal Boron Nitride

Hexagonal boron nitride (h-BN) is a technologically important layered material used as a dielectric spacer, encapsulant, ultraviolet laser emitter, and hyperbolic material in electronic and photonic applications1,2,3. More recently, h-BN has attracted attention for thermal management of electronics as theoretical calculations4predicted an

New Polymer Films Conduct Heat Instead of Trapping It

Polymers are usually the go-to material for thermal insulation. Think of a silicone oven mitt, or a Styrofoam coffee cup, both manufactured from polymer materials that are excellent at trapping heat. Now MIT engineers have flipped the picture of the standard polymer