Rogers Corp. Introduces TC350 Plus Laminates

Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited

RUAG Space Produces Thermal Insulation for Launchers

RUAG Space has kicked off a new product line, thermal insulation for launch vehicles. “We have more than 25 years of experience in high-quality thermal insulation for satellites. Building upon this knowledge we enter a new market segment and produce thermal insulation

Researchers Introduce Novel Heat Transport Theory

NCCR MARVEL researchers have developed a novel microscopic theory that is able to describe heat transport in very general ways, and applies equally well to ordered or disordered materials such as crystals or glasses and to anything in between. This is not

Rice University Unveils New Way to Beat the Heat in Electronics

A nanocomposite invented at Rice University’s Brown School of Engineering promises to be a superior high-temperature dielectric material for flexible electronics, energy storage and electric devices. The nanocomposite combines one-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets. The nanofibers reinforce the self-assembling material while the “white graphene” nanosheets

Ultra-Compressible Thermal Putty

Sarcon PG80A is an extremely compressible, high-performance thermal interface material. This advanced putty-like, gap filler pad exhibits a thermal resistance as low as 0.08°C•in2/W at 14.5 PSI with a thermal conductivity of 13 W/m°K. Sarcon® PG80A requires very low compression force at

Two Types of Cooling Require Different Designs

Thermoelectric devices can be used to remove heat from hot objects, like computer components or batteries. However, these so-called Peltier coolers are typically optimized for keeping a cold object cold, which is a different thermodynamics problem. Researchers have now developed a new

Modulating the Thermal Conductivity in Hexagonal Boron Nitride

Hexagonal boron nitride (h-BN) is a technologically important layered material used as a dielectric spacer, encapsulant, ultraviolet laser emitter, and hyperbolic material in electronic and photonic applications1,2,3. More recently, h-BN has attracted attention for thermal management of electronics as theoretical calculations4predicted an

New Polymer Films Conduct Heat Instead of Trapping It

Polymers are usually the go-to material for thermal insulation. Think of a silicone oven mitt, or a Styrofoam coffee cup, both manufactured from polymer materials that are excellent at trapping heat. Now MIT engineers have flipped the picture of the standard polymer