Electronics Keep Their Cool With New Heat-Conducting Crystals

The inner workings of high-power electronic devices must remain cool to operate reliably. High internal temperatures can make programs run slower, freeze or shut down. Researchers at the University of Illinois at Urbana-Champaign and The University of Texas, Dallas have collaborated to

Two-Channel Model for Ultralow Thermal Conductivity of Crystalline

The search for materials with extreme thermal properties continues because of their importance for thermal management applications. Materials with low κ are used in data storage devices, thermal barrier coatings, and thermoelectrics, whereas high-κ materials are useful for thermal energy transmission and

Observation of Anisotropic Magneto-Peltier Effect

For the first time in the world, NIMS and Tohoku University jointly observed an anisotropic magneto-Peltier effect–a thermoelectric conversion phenomenon in which simple redirection of a charge current in a magnetic material induces heating and cooling. Thermoelectric heating and cooling are conventionally

3D Printed Impingement Chip Cooler Cools ICs like a Showerhead

High performance electronic systems are coping with increasing cooling demands. Conventional solutions realize cooling through combining heat exchangers that are bonded to heat spreaders that are then attached to the chip backside. These are all interconnected with thermal interface materials (TIM) that

Researcher Develops a New Generation of Graphene

Graphene has many incredible properties, but to date it has been difficult to use on a large scale in industry due to the fact it loses its properties and goes back to its origin graphite when it is used in that scale.

6SigmaET Release Enhances Modelling for Faster Thermal Simulation

Future Facilities has launched Release 12 of its thermal simulation software, 6SigmaET. This release incorporates a number of significant modelling enhancements that deliver another boost to overall simulation speed – extending 6SigmaET’s performance advantage compared to alternative tools. Release 12 also includes