For PCBA design and quality control, engineers need to frequently detect short-circuit device, optimize heat dissipation, and repair the fault. Choosing the right test tool can greatly improve the working efficiency and save cost.
Thermal imaging camera can be used to quickly locate hotspots and generate a full-field heat map with temperature quantity of each pixel, significantly improving the performance of PCBA engineers. Engineers now can compare the thermal imaging heat map of the faulty board with the normal working thermal imaging heat map, to easily and quickly locate the components with abnormal heat and temperature, and then conduct targeted tests to significantly improve the diagnosis efficiency.
One infrared thermal image records an instantaneous temperature at a certain time, however, the failure of the PCBA happens in milliseconds and it is almost impossible to be captured by a static thermal image. And for some cases, the post-failure thermal imaging heat map is similar to the normal heat map, which is even harder for the engineers to make a conclusion of the failure cause. For these cases of PCBA testing, it is necessary to capture the dynamic process of the temperature changes in order to identify the cause of the problem. Radiometric video recording can continuous monitoring the temperature changes and capture the moment. Through the post-analysis of the radiometric video, one can pinpoint the failing component and identify the cause of failure.