The increase of video hungry workloads for applications of Artificial Intelligence (AI) and Deep Learning (DL) has led to the demand for new form factors to meet customer requirements and expand into new markets. One of these new form factors to IOTG is a Low Profile Half Length PCIe Add-In-Card (A.I.C) for High Density Deep Learning (HDDL) applications. It is not a new form factor overall but rather a new one to IOTG customers.
The HDDL products can consist of, up to, eight Visual Processing Units (VPU), a PCIe switch, voltage regulators and other peripheral devices that may require cooling. The introduction of this new form factor to IOTG requires a thermal and mechanical testing, validation and verification procedure to be in place to ensure the reliability and viability of these products and their thermal solutions. Attend this session to learn how AI and DL is pushing the boundaries of thermal system and product design.