Ultra-Compressible Thermal Putty

Sarcon PG80A is an extremely compressible, high-performance thermal interface material. This advanced putty-like, gap filler pad exhibits a thermal resistance as low as 0.08°C•in2/W at 14.5 PSI with a thermal conductivity of 13 W/m°K. Sarcon® PG80A requires very low compression force at

Ultra Soft and Extremely Affordable Thermal Gap Filler Released

Sarcon PG25A is one of Fujipoly’s softest, most compressible and affordable thermal gap filler materials. It offers gel like consistency in a convenient sheet form. The product is ideal for applications that have delicate components and high compression rates. When it is

Reinforced Thermal Film for Die-Cutting Released

New thermal interface composite film has been released by Fujipoly. The Sarcon 15GTR is a thin TIM made from heat conducting silicon with a 0.05 mm fiberglass reinforcement layer. The 0.15 mm think film is suited for applications with complex die-cut shapes,