Rice University Unveils New Way to Beat the Heat in Electronics

A nanocomposite invented at Rice University’s Brown School of Engineering promises to be a superior high-temperature dielectric material for flexible electronics, energy storage and electric devices. The nanocomposite combines one-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets. The nanofibers reinforce the self-assembling material while the “white graphene” nanosheets

Modulating the Thermal Conductivity in Hexagonal Boron Nitride

Hexagonal boron nitride (h-BN) is a technologically important layered material used as a dielectric spacer, encapsulant, ultraviolet laser emitter, and hyperbolic material in electronic and photonic applications1,2,3. More recently, h-BN has attracted attention for thermal management of electronics as theoretical calculations4predicted an

Henkel Launches new Silicone-Free Gap Filler for Electric Vehicles

Henkel will launch new technologies that enable cost-efficient large-scale assembly and lifetime protection of battery architectures. As all major automotive OEMs and new players are rapidly launching new electric vehicle (EV) models, Henkel is leveraging its broad technology base and many years

Researchers Find Ways to Image, Characterize Unique New Material

Graphene can come from graphite, but borophene? There’s no such thing as borite. Unlike its carbon cousin, two-dimensional borophene can’t be reduced from a larger natural form. Bulk boron is usually only found in combination with other elements, and is certainly not layered,

Unitika Unveils High-Heat Aromatic Polyamide

Unitika has developed a series of polyamide (PA) resins that can be applied in demanding thermal-management applications. The company has tailored specific grades for applications such as LED components and electric motor parts that are utilized in the auto and electrical/electronic sectors

DARPA to Host Hypersonic Thermal Management Material Design Program

The Defense Advanced Research Projects Agency will conduct a Proposers Day on Jan. 22 in Arlington, Va., to discuss a new program that aims to build and demonstrate structures designed to address the thermal challenge associated with hypersonic vehicles’ leading edges. “For decades people

New Way to Cool Computer Chips Involves Laser Metal Printing

Researchers from Binghamton University’s Mechanical Engineering Department have developed a manufacturing technique that will keep electronics cooler by 10 degrees Celsius (18 degrees Fahrenheit), allowing for faster, more efficient computation. Assistant Professor Scott Schiffres and graduate students Arad Azizi and Matthias A.